Packaging technology is a bit of an unsung hero in the smart card world. Coil on Module technology, however, is seriously exciting stuff, cutting the Total Cost of Ownership substantially. Krowne wrote a short whitepaper on the topic for Infineon Technologies. The paper is part of an integrated campaign promoting this innovative approach and was published for the Trustech in December this year. Communicating technology is still very much the core of Krowne’s services.
The paper can be downloaded by following this link.